Polymer with solder pre-coated fillers for thermal interface materials
US7036573B2 · kind B2 · utility
12Cited by
11References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 8, 2002 |
| Grant date | May 2, 2006 |
| Priority date | — |
| Expiry date | Feb 8, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S165/905
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A thermal interface material made of a binder material and a fusible filler.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.