Method of producing an electronic component
US7037761B2 · kind B2 · utility
7Cited by
5References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 7, 2005 |
| Grant date | May 2, 2006 |
| Priority date | — |
| Expiry date | Jan 7, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic component includes a semiconductor chip that has an active upper side with integrated circuits and a passive rear side. The rear side and the side border regions of the semiconductor chip also form the outer package sides of the electronic component. At least the corner regions and the edge regions of the rear side and the side border regions of the semiconductor chip have a plastic coating with a thickness in the micrometer range. Furthermore, the invention relates to a method of producing such an electronic component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.