Methods and apparatus for attaching a die to a substrate
US7037805B2 · kind B2 · utility
4Cited by
14References
61Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 28, 2004 |
| Grant date | May 2, 2006 |
| Priority date | — |
| Expiry date | Jun 28, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19041
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for increasing the bonding strength between a die and a housing for the die is described where a micro-electromechanical system (MEMS) device is formed on the die. The method includes depositing a plurality of contacts of bonding material between the substrate and die, and forming a bond between the die and the housing by applying at least 25,000 kilograms of force per gram of bonding material to the housing, the contacts, and the die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.