Method for polishing organic film on semiconductor substrate by use of resin particles, and slurry
US7037839B2 · kind B2 · utility
2Cited by
7References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 30, 2003 |
| Grant date | May 2, 2006 |
| Priority date | — |
| Expiry date | Dec 19, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02271
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for polishing an organic film, comprising polishing an exposed organic film provided on a semiconductor substrate by use of slurry containing resin particles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.