Multi-path bar bond connector for an integrated circuit assembly
US7038308B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 17, 2004 |
| Grant date | May 2, 2006 |
| Priority date | — |
| Expiry date | Oct 16, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15787
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A solderable bar bond connector establishes a primary interconnect between a substrate and a high current terminal of an IC chip mounted on the substrate, and one or more secondary interconnects between the substrate and low current terminals of the IC chip. The bar bond connector includes a plate portion soldered to the high current terminal of the IC chip and a plurality of leg elements extending from the plate portion to multiple bond sites on the substrate. The underside of at least one leg element is provided with a secondary circuit including a conductor that is electrically isolated from the respective leg element. The conductor of the secondary circuit is soldered to both the substrate and a low current terminal of the IC chip for establishing a secondary interconnect in addition to the primary interconnect established by the plate portion and the other leg elements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.