Patent · US Expired

Wafer stacking using interconnect structures of substantially uniform height

US7038324B2 · kind B2 · utility

1Cited by
3References
14Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMar 31, 2004
Grant dateMay 2, 2006
Priority date—
Expiry dateMar 31, 2024

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/14
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

Wafer stacking employing substantially uniform copper structures is described herein.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.