Inventor · Hillsboro, OR, US

Vijayakumar Ramachandrarao

24Patents
8h-index
20Co-inventors
67Inventor score

Filing activity: Jun 10, 2002 → Jan 23, 2009

Most-cited inventions

PatentTitleAreaCited byStatus
US6812132B2 Filling small dimension vias using supercritical carbon dioxide Electricity 38 Expired
US7005390B2 Replenishment of surface carbon and surface passivation of low-k porous silicon-based dielectric materials Emerging Cross-Sectional Technologies 36 Expired
US7238604B2 Forming thin hard mask over air gap or porous dielectric Electricity 32 Expired
US7374867B2 Enhancing photoresist performance using electric fields Physics 19 Expired
US7022655B2 Highly polar cleans for removal of residues from semiconductor structures Chemistry; Metallurgy 10 Expired
US8080475B2 Removal chemistry for selectively etching metal hard mask Electricity 9 Active
US6624127B1 Highly polar cleans for removal of residues from semiconductor structures Chemistry; Metallurgy 9 Expired
US6974762B2 Adhesion of carbon doped oxides by silanization Electricity 9 Expired
US7179757B2 Replenishment of surface carbon and surface passivation of low-k porous silicon-based dielectric materials Emerging Cross-Sectional Technologies 7 Expired
US7335586B2 Sealing porous dielectric material using plasma-induced surface polymerization Electricity 7 Active
US7605073B2 Sealants for metal interconnect protection in microelectronic devices having air gap interconnect structures Electricity 7 Active
US6620741B1 Method for controlling etch bias of carbon doped oxide films Electricity 6 Expired
US7220668B2 Method of patterning a porous dielectric material Electricity 6 Expired
US7977228B2 Methods for the formation of interconnects separated by air gaps Electricity 4 Active
US7214605B2 Deposition of diffusion barrier Electricity 2 Expired
US7303648B2 Via etch process Emerging Cross-Sectional Technologies 1 Expired
US7049053B2 Supercritical carbon dioxide to reduce line edge roughness Physics 1 Expired
US7038324B2 Wafer stacking using interconnect structures of substantially uniform height Electricity 1 Expired
US7233068B2 Filling small dimension vias using supercritical carbon dioxide Electricity 1 Expired
US7422020B2 Aluminum incorporation in porous dielectric for improved mechanical properties of patterned dielectric Chemistry; Metallurgy 0 Active
US7101443B2 Supercritical carbon dioxide-based cleaning of metal lines Chemistry; Metallurgy 0 Expired
US8017568B2 Cleaning residues from semiconductor structures Chemistry; Metallurgy 0 Active
US7268015B2 Method for wafer stacking using copper structures of substantially uniform height Electricity 0 Expired
US7018938B2 Controlled use of photochemically susceptible chemistries for etching, cleaning and surface conditioning Electricity 0 Expired

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.