EMI filter terminal assembly with wire bond pads for human implant applications
US7038900B2 · kind B2 · utility
156Cited by
41References
176Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 10, 2004 |
| Grant date | May 2, 2006 |
| Priority date | — |
| Expiry date | Nov 24, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/4847
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
An electro-magnetic interference filter terminal assembly for active implantable medical devices includes a structural pad in the form of a substrate or attached wire bond pad, for convenient attachment of wires from the circuitry inside the implantable medical device to the capacitor structure via thermal or ultrasonic bonding, soldering or the like while shielding the capacitor from forces applied to the assembly during attachment of the wires.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.