Modeling process for integrated circuit film resistors
US7039888B2 · kind B2 · utility
27Cited by
1References
14Claims
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Key dates
| Filing date | Dec 4, 2003 |
| Grant date | May 2, 2006 |
| Priority date | — |
| Expiry date | Mar 24, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2891
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method is presented, in which a thin film resistor is modeled to account for self-heating. The method includes fabricating the thin film resistor and characterizing a thermal resistance of the thin film resistor, wherein the thermal resistance accounts for self-heating thereof during operation. The thermal resistance is then used in a model for simulating integrated circuits using the thin film resistor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.