Table of wafer polishing apparatus, method for polishing semiconductor wafer, and method for manufacturing semiconductor wafer
US7040963B1 · kind B1 · utility
11Cited by
5References
37Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 15, 2000 |
| Grant date | May 9, 2006 |
| Priority date | — |
| Expiry date | Jun 20, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B41/047
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A table for a wafer polishing apparatus having superior heat-resistant, anti-thermal-shock, and anti-abrasion characteristics and capable of increasing the diameter of a semiconductor wafer while improving the quality of the wafer. The table (2) includes a plurality of superimposed bases (11) each of which is formed of silicide ceramic or carbide ceramic. The bases (11) are joined together by an adhesive layer (14). A fluid passage (12) is formed in a joining interface between the bases (11).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.