Timing apparatus and method to selectively bias during sputtering
US7041202B2 · kind B2 · utility
6Cited by
20References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 28, 2003 |
| Grant date | May 9, 2006 |
| Priority date | — |
| Expiry date | Apr 24, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/34
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A system and method for sputtering using a plurality of different bias voltages, a plurality of target-cathodes that can be powered at different voltages disposed along said path of travel, and a controller configured to selectively vary the target-cathode voltage and the pallet bias voltage while the pallet moves along the path of travel. The target-cathodes are spaced apart along the path of travel by a distance less than a length of the pallet and on both sides of the path of travel. The controller can include a timing circuit for synchronizing changes in the target-cathode voltages with changes in the pallet bias voltage.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.