Light blocking layers in MEMS packages
US7042623B1 · kind B1 · utility
84Cited by
2References
52Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 19, 2004 |
| Grant date | May 9, 2006 |
| Priority date | — |
| Expiry date | Oct 23, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B26/0833
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Disclosed herein is a micromirror array device package having a light absorbing material disposed within the package for reducing undesired light scattering. The light absorbing material can be deposited as a thin film (or strip, frame, segments or a combination thereof), or as a vertical wall insert between the micromirror array device and a cover substrate of the package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.