Clamping structure and heat dissipating module using same
US7042728B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 16, 2004 |
| Grant date | May 9, 2006 |
| Priority date | — |
| Expiry date | Jul 30, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T24/4447
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A clamping structure is used to fix a heat-dissipating body on a chip module. The clamping structure comprises a clamping body, two clamping portions, a pivot element, a top frame and a bottom frame. The two clamping portions are respectively connected to two sides of the clamping body and are clamped to the bottom frame. The pivot element is pivotally connected to the clamping body and has a movable portion and an ear piece. The ear piece has a fixed portion and a release portion respectively formed at an end side thereof for fixing and releasing the heat-dissipating body. The clamping structure is used to eliminate a spare gap between the clamping element and the top frame, and clamping element and the bottom frame without using the elastic element. The clamping structure can also be used with a heat sink to form a heat-dissipating module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.