Thermal interface apparatus, systems, and fabrication methods
US7042729B2 · kind B2 · utility
8Cited by
7References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 24, 2003 |
| Grant date | May 9, 2006 |
| Priority date | — |
| Expiry date | Nov 15, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/1438
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus and system, as well as fabrication methods therefor, may include a unitary, substantially uniformly distributed transfer material coupled to a carrier material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.