Rajen Dias
12Patents
5h-index
10Co-inventors
59Inventor score
Filing activity: Nov 30, 2001 → Jun 29, 2016
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7078822B2 | Microelectronic device interconnects | Emerging Cross-Sectional Technologies | 46 | Expired |
| US6812548B2 | Backside metallization on sides of microelectronic dice for effective thermal contact with heat dissipation devices | Electricity | 17 | Expired |
| US6790709B2 | Backside metallization on microelectronic dice having beveled sides for effective thermal contact with heat dissipation devices | Electricity | 14 | Expired |
| US6955947B2 | Backside metallization on microelectronic dice having beveled sides for effective thermal contact with heat dissipation devices | Electricity | 9 | Expired |
| US7042729B2 | Thermal interface apparatus, systems, and fabrication methods | Emerging Cross-Sectional Technologies | 8 | Expired |
| US6815831B2 | Flip-chip device with multi-layered underfill having graded coefficient of thermal expansion | Electricity | 5 | Expired |
| US7064014B2 | Backside metallization on sides of microelectronic dice for effective thermal contact with heat dissipation devices | Electricity | 4 | Expired |
| US6861285B2 | Flip chip underfill process | Electricity | 3 | Expired |
| US9412702B2 | Laser die backside film removal for integrated circuit (IC) packaging | Electricity | 2 | Active |
| US7314817B2 | Microelectronic device interconnects | Emerging Cross-Sectional Technologies | 2 | Active |
| US9859248B2 | Laser die backside film removal for integrated circuit (IC) packaging | Electricity | 2 | Active |
| US7317258B2 | Thermal interface apparatus, systems, and fabrication methods | Emerging Cross-Sectional Technologies | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.