Lithography apparatus and method employing non-environmental variable correction
US7043327B2 · kind B2 · utility
5Cited by
5References
20Claims
0Family size
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Key dates
| Filing date | Aug 12, 2003 |
| Grant date | May 9, 2006 |
| Priority date | — |
| Expiry date | Jun 14, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F1/36
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A lithographic apparatus for forming a patterned resist layer and a method for forming a microelectronic product both employ a lithographic exposure tool controller designed to: (1) receive input data for at least one non-environmental variable that influences an exposure dose when forming a patterned resist layer from a blanket resist layer while employing a lithographic exposure tool; and (2) determine the exposure dose for forming the patterned resist layer from the blanket resist layer while employing the input data. The apparatus and method provide for forming the microelectronic product with enhanced dimensional control.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.