Method for producing micromechanic sensors and sensors produced by said method

US7045382B2 · kind B2 · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Hubert Benzel · Neckartenzlingen, DE
• Heribert Weber · Leverkusen, DE
• Hans Artmann · Magstadt, DE
• Frank Schaefer · Lörrach, DE

Key dates

• Filing date: Mar 13, 2002
• Grant date: May 16, 2006
• Expiry date: Mar 13, 2022

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B81C2203/0742
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

Proposed is a method for manufacturing micromechanical sensors and sensors manufactured by this method, where openings are introduced into a semiconductor substrate. After the openings are introduced into the semiconductor substrate, a subsequent temperature treatment is carried out, in which the openings are converted into voids in the depth of the substrate.