Semiconductor device package
US7045884B2 · kind B2 · utility
115Cited by
5References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 1, 2003 |
| Grant date | May 16, 2006 |
| Priority date | — |
| Expiry date | Oct 1, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package that includes two circuit boards and at least one semiconductor device which is disposed between the two circuit boards and connected to external connectors disposed on at least one of the circuit boards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.