Micro-electromechanical sensor
US7047814B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 17, 2002 |
| Grant date | May 23, 2006 |
| Priority date | — |
| Expiry date | Jul 17, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L9/0073
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A force or pressure transducer is disclosed. In one embodiment, the transducer has a substrate, a dielectric material disposed on the substrate, a spacing member disposed on the dielectric material, and a resilient element disposed on the dielectric material and the spacing member. A portion of the resilient element is separated from the dielectric material, and a portion of the resilient element is in contact with the dielectric material. The contact area between the resilient element and the dielectric material varies in response to movement of the resilient element. Changes in the contact area alter the capacitance of the transducer, which can be measured by circuit means.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.