Wave soldering method using lead-free solder, apparatus therefor, and wave-soldered assembly
US7048173B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 25, 2002 |
| Grant date | May 23, 2006 |
| Priority date | — |
| Expiry date | Aug 8, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R4/625
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a wave soldering method and a wave soldering apparatus using lead-free solder comprising a wave soldering step in which the lower side of a substrate with leads of component parts inserted in through-holes formed in the substrate from the upper side is wave soldered by contact with a molten lead-free solder blowout at a wave soldering portion provided in a chamber, and a cooling step in which an inert gas in the chamber is recirculated and cooled and is blown to the lower side of the substrate wave soldered with the lead-free solder in the wave soldering step and being conveyed, to cool the lower side of the substrate, at a blowing portion provided adjacently to the wave soldering portion in the chamber, and an apparatus therefor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.