Supercritical carbon dioxide to reduce line edge roughness
US7049053B2 · kind B2 · utility
1Cited by
1References
16Claims
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Key dates
| Filing date | Jun 11, 2003 |
| Grant date | May 23, 2006 |
| Priority date | — |
| Expiry date | Apr 1, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/40
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Polymer aggregates in a photoresist layer may be dissolved or reduced in dimension by treatment with supercritical carbon dioxide. The supercritical carbon dioxide may be used before and/or after development of the photoresist. The SCCO2 treatment causes swelling of the photoresist and may allow polymer aggregates in the photoresist to be dissolved. Controlled release of the carbon dioxide de-swells the photoresist, resulting in reduced line edge roughness of openings in the photoresist and reduced resistance of metal lines formed in the openings.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.