Methods and apparatus for making integrated circuit package including opening exposing portion of the IC
US7049166B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Aug 16, 2001 |
| Grant date | May 23, 2006 |
| Priority date | — |
| Expiry date | Mar 23, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for making an IC package preferably includes providing a mold including first and second mold portions, and wherein the first mold portion carries a mold protrusion defining an IC-contact surface with peripheral edges and a bleed-through retention channel positioned inwardly from the peripheral edges. The method also preferably includes closing the first and second mold portions around the IC and injecting encapsulating material into the mold to encapsulate the IC and make the IC package having an exposed portion of the IC adjacent the mold protrusion. Morever, the bleed-through retention channel retains any encapsulating material bleeding beneath the peripheral edges of the IC contact surface, and prevents the encapsulating material from reaching further onto the exposed portion of the IC. The method may also include releasing the IC package with the exposed portion from the mold.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.