Probe sheet, probe card, semiconductor test equipment and semiconductor device fabrication method
US7049837B2 · kind B2 · utility
33Cited by
9References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 2, 2003 |
| Grant date | May 23, 2006 |
| Priority date | — |
| Expiry date | Oct 2, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A probe card has first contact terminals electrically connected to the fine-pitch electrodes of a test target; wirings drawn from the first contact terminals; and second contact terminals electrically connected to the wirings, wherein the first contact terminals are formed each using an anisotropically etched hole in a crystalline substrate, and a semiconductor device test method (fabrication method) using the probe card.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.