Slurry and use thereof for polishing

US7052625B2 · kind B2 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Timothy Scott Chamberlin · Saint Albans, US
• Michael MacDonald · Batavia, US
• Mark P. Murray · Burlington, US

Key dates

• Filing date: Mar 28, 2001
• Grant date: May 30, 2006
• Expiry date: Apr 3, 2023

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/3212
• WIPO field: Basic materials chemistry
• WIPO sector: Chemistry

Abstract

A slurry containing abrasive particles, an oxidizing agent having a low static etch rate on at least one acid or salt metal, and having a pH of about 5 to about 11 is especially useful for polishing surfaces, including both metal and silicon dioxide, such as present in microelectronics, at the same or substantially the same polishing rates.