Fabrication of movable micromechanical components employing low-cost, high-resolution replication technology method
US7052926B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 20, 2004 |
| Grant date | May 30, 2006 |
| Priority date | — |
| Expiry date | Dec 20, 2024 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB33Y80/00
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method of fabricating a high-aspect ratio micro-mechanical device or system with dimensions that can vary from nanometers to millimeters is disclosed. According to the method, a tool master with a high-aspect ratio, submicron lateral resolution and vertical dimensions substantially corresponding to the vertical dimensions of the device or system is formed. The tool master and a substrate sized for the device or system are heated to a temperature at which the substrate becomes compliant. The heated tool master and substrate are then pressed together so as to imprint the shape and form of the tool master into the substrate. The temperature of the tool master and substrate are then lowered, whereupon the tool master and substrate are separated and cooled to ambient temperature. The tool master can have a plurality of duplications to form a plurality of devices or systems. The substrate is composed of a laminate comprised of a sacrificial layer and a structural layer. The sacrificial layer can be removed to release the structural layer and thereby form a movable device or system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.