Use of polybenzoxazoles (PBOS) for adhesion

US7052936B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Andreas Walter · Egloffstein, DE
• Recai Sezi · Simmerath, DE

Key dates

• Filing date: Jul 30, 2002
• Grant date: May 30, 2006
• Expiry date: Sep 13, 2022

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C09J179/06
• WIPO field: Basic materials chemistry
• WIPO sector: Chemistry

Abstract

The present invention describes the use of polybenzoxazoles (PBOs) for adhesively bonding articles or materials, especially components used in the semiconductor industry, such as chips and wafers, a process for adhesively bonding materials, especially chips and wafers, chip and/or wafer stacks produced by the process, and adhesive compositions which comprise the polybenzoxazoles of the formula (I).