Flexible wiring boards
US7053312B2 · kind B2 · utility
2Cited by
28References
6Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Aug 14, 2003 |
| Grant date | May 30, 2006 |
| Priority date | — |
| Expiry date | Dec 11, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A flexible wiring board are formed by growing metal bumps using a mask film patterned by photolithography. Fine openings can be formed with good precision, therefore, fine metal bumps can be formed with good precision because laser beam is not used to form opening in a polyimide film. After metal bumps have been formed, the mask film is removed and a liquid resin material is applied and dried to form a coating, which is then cured into a resin film. The coating can be etched at surface portions during coating stage to exposed the tops of metal bumps.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.