Electronic component having micro-electrical mechanical system
US7053456B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 2, 2004 |
| Grant date | May 30, 2006 |
| Priority date | — |
| Expiry date | Jun 2, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/16225
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An electronic component includes a semiconductor substrate having a first surface and a second surface opposite to the first surface, a cavity that penetrates from the first surface to the second surface of the semiconductor substrate, and an electrical mechanical element that has a movable portion formed above the first surface of the semiconductor substrate so that the movable portion is arranged above the cavity. The electronic component further includes an electric conduction plug, which penetrates from the first surface to the second surface of the semiconductor substrate, and which is electrically connected to the electrical mechanical element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.