Slotted adhesive for die-attach in BOC and LOC packages
US7054161B1 · kind B1 · utility
14Cited by
9References
66Claims
0Family size
Inventor
Key dates
| Filing date | Apr 19, 2000 |
| Grant date | May 30, 2006 |
| Priority date | — |
| Expiry date | Apr 19, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for attaching an integrated circuit die to a leadframe or substrate. More specifically, a patterned adhesive material is used to attach an integrated circuit die to a leadframe in an LOC package, or a substrate in a BOC package. The patterned adhesive may be a tape or any other suitable material for attaching an I/C to a substrate or leadframe. The adhesive patterns may be configured to form strips of adhesive material or may be a solid piece of material with apertures cut therethrough.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.