Stephen James
32Patents
8h-index
19Co-inventors
72Inventor score
Filing activity: Dec 23, 1991 → Sep 13, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7323767B2 | Standoffs for centralizing internals in packaging process | Electricity | 113 | Expired |
| US6518678B2 | Apparatus and method for reducing interposer compression during molding process | Electricity | 20 | Expired |
| US6815835B2 | Single sided adhesive tape for compound diversion on BOC substrates | Emerging Cross-Sectional Technologies | 17 | Expired |
| US7054161B1 | Slotted adhesive for die-attach in BOC and LOC packages | Electricity | 14 | Expired |
| US6979595B1 | Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devices | Electricity | 11 | Expired |
| US6451629B2 | Leadframe alteration to direct compound flow into package | Electricity | 10 | Expired |
| US6396133B1 | Semiconductor device with heat-dissipating lead-frame and process of manufacturing same | Electricity | 10 | Expired |
| US6278175A | Leadframe alteration to direct compound flow into package | Electricity | 9 | Expired |
| US6473311B1 | Gate area relief strip for a molded I/C package | Emerging Cross-Sectional Technologies | 7 | Expired |
| US7049685B2 | Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devices | Electricity | 6 | Expired |
| US7459797B2 | Standoffs for centralizing internals in packaging process | Electricity | 5 | Expired |
| US7927923B2 | Method and apparatus for directing molding compound flow and resulting semiconductor device packages | Electricity | 4 | Active |
| US7462510B2 | Standoffs for centralizing internals in packaging process | Electricity | 3 | Expired |
| US6690086B2 | Apparatus and method for reducing interposer compression during molding process | Electricity | 3 | Expired |
| US8207599B2 | Method and apparatus for directing molding compound flow and resulting semiconductor device packages | Electricity | 2 | Active |
| US5401829A | Biologically active molecules | Emerging Cross-Sectional Technologies | 2 | Expired |
| US7053467B2 | Leadframe alteration to direct compound flow into package | Electricity | 2 | Expired |
| US7271037B2 | Leadframe alteration to direct compound flow into package | Electricity | 2 | Expired |
| US5864008A | Peptides derived from foot-and-mouth disease virus, pharmaceutical compositions, and methods for using the peptides | Emerging Cross-Sectional Technologies | 2 | Expired |
| US8399966B2 | Inserts for directing molding compound flow and semiconductor die assemblies | Electricity | 1 | Active |
| US6734372B2 | Gate area relief strip for a molded I/C package | Emerging Cross-Sectional Technologies | 1 | Expired |
| US10443733B2 | Seal assembly with energizer and seal element | Mechanical Engineering; Lighting; Heating | 1 | Active |
| US6657132B2 | Single sided adhesive tape for compound diversion on BOC substrates | Emerging Cross-Sectional Technologies | 1 | Expired |
| US6498182B2 | Compounds | Human Necessities | 0 | Expired |
| US8716847B2 | Inserts for directing molding compound flow and semiconductor die assemblies | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.