Wafer chucking apparatus and method for spin processor
US7056392B1 · kind B1 · utility
6Cited by
2References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 16, 2003 |
| Grant date | Jun 6, 2006 |
| Priority date | — |
| Expiry date | Aug 3, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68728
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer chuck is configured to hold a wafer efficiently for spin process cleaning of wafer edges and back sides. A first group of retractable tips extend to hold the wafer during a first portion of the cleaning period. A second group of retractable tips extend to hold the wafer during a second portion of the cleaning period. Residues left between the tips and the wafer edge areas during the first portion of the cleaning period are removed during the second portion. The change from the first group of tips to the second group of tips occurs while the wafer is rotating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.