Electronic device manufacture
US7056824B2 · kind B2 · utility
2Cited by
13References
15Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 19, 2003 |
| Grant date | Jun 6, 2006 |
| Priority date | — |
| Expiry date | Dec 25, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/32139
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing electronic devices containing one or more layers of materials that are sensitive to the strong chemicals used to remove cross-linked polymeric layers such as photoresists and antireflective coatings is provided. The cross-linked polymeric layers can be easily removed following etching through the use of certain removable layers disposed between the substrate and the cross-linked polymeric layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.