Semiconductor structures having through-holes sealed with feed-through metalization
US7057274B2 · kind B2 · utility
26Cited by
23References
10Claims
0Family size
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Inventor
Key dates
| Filing date | Jul 20, 2004 |
| Grant date | Jun 6, 2006 |
| Priority date | — |
| Expiry date | Jul 20, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49126
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Semiconductor structures with one or more through-holes are disclosed. A feed-through metallization process may be used to seal the through-holes hermetically.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.