Method of and mechanism for peeling adhesive tape bonded to segmented semiconductor wafer
US7060593B2 · kind B2 · utility
33Cited by
6References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 26, 2002 |
| Grant date | Jun 13, 2006 |
| Priority date | — |
| Expiry date | Aug 30, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1944
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An adhesive tape peeling mechanism has an adhering section and a porous member. The adhering section adheres to a segmented semiconductor wafer bonded to adhesive tape. The porous member is provided on the surface adhering to the semiconductor wafer of the adhering section. The porous member is divided into at least two adhering areas in the direction in which the adhesive tape is peeled. The porous member adheres to the semiconductor wafer by suction and fixes the wafer in place.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.