Epoxy resin compositions
US7060761B2 · kind B2 · utility
8Cited by
7References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 13, 2003 |
| Grant date | Jun 13, 2006 |
| Priority date | — |
| Expiry date | Aug 4, 2024 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L83/14
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An epoxy resin composition comprising (i) a compound having at least two epoxy groups in a molecule as a main component, (ii) a fluorene skeleton-bearing, silicone-modified phenolic resin as a curing agent, and (iii) an organophosphorus compound, amine compound or imidazole compound as a cure accelerator cures into an elastomeric product having a low elasticity, toughness and low dielectric properties.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.