Structure of image sensor module and a method for manufacturing of wafer level package
US7061106B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 28, 2004 |
| Grant date | Jun 13, 2006 |
| Priority date | — |
| Expiry date | Aug 6, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/806
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention discloses an image sensor module and forming method of wafer level package. The image sensor module comprises an isolating base, a wafer level package, a lens holder, and a F.P.C.. The wafer level package having a plurality of image sensor dies and a plurality of solder balls is attached to the isolating base. A plurality of lens are placed in the lens holder, and the lens holder is located on the image sensor dies. The lens holder is placed in the F.P.C., and the F.P.C. has a plurality of solder joints coupled to the solder balls for conveniently transmitting signal of the image sensor dies. Moreover, the image sensor dies may be packaged with passive components or other dies with a side by side structure or a stacking structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.