Patent assignee · TW · COMPANY

Advanced Chip Engineering Technology, Inc.

39Patents
29Active
39Granted
47Portfolio score

Filing activity: Apr 28, 2004 → Nov 10, 2009 · 29 expiring within 5 years

Most-cited patents

PatentTitleAreaCited byStatus
US7238602B2 Chip-size package structure and method of the same Electricity 68 Expired
US7339279B2 Chip-size package structure and method of the same Electricity 58 Active
US8178964B2 Semiconductor device package with die receiving through-hole and dual build-up layers over both side-surfaces for WLP and method of the same Electricity 47 Active
US8178963B2 Wafer level package with die receiving through-hole and method of the same Electricity 43 Active
US7667318B2 Fan out type wafer level package structure and method of the same Electricity 40 Active
US7655501B2 Wafer level package with good CTE performance Electricity 34 Active
US7514767B2 Fan out type wafer level package structure and method of the same Electricity 33 Active
US7061106B2 Structure of image sensor module and a method for manufacturing of wafer level package Electricity 29 Expired
US7812434B2 Wafer level package with die receiving through-hole and method of the same Electricity 27 Active
US7534632B2 Method for circuits inspection and method of the same Electricity 27 Active
US7453148B2 Structure of dielectric layers in built-up layers of wafer level package Electricity 25 Active
US7501310B2 Structure of image sensor module and method for manufacturing of wafer level package Electricity 19 Active
US7557437B2 Fan out type wafer level package structure and method of the same Electricity 17 Active
US7279782B2 FBGA and COB package structure for image sensor Electricity 13 Expired
US7884464B2 3D electronic packaging structure having a conductive support substrate Electricity 12 Active
US7911044B2 RF module package for releasing stress Electricity 12 Active
US7525185B2 Semiconductor device package having multi-chips with side-by-side configuration and method of the same Electricity 10 Active
US7423335B2 Sensor module package structure and method of the same Electricity 9 Active
US7884461B2 System-in-package and manufacturing method of the same Electricity 8 Active
US7224061B2 Package structure Electricity 8 Expired
US7176567B2 Semiconductor device protective structure and method for fabricating the same Electricity 7 Expired
US7446546B2 Method and system of trace pull test Electricity 7 Active
US7319043B2 Method and system of trace pull test Electricity 7 Expired
US7459729B2 Semiconductor image device package with die receiving through-hole and method of the same Electricity 6 Active
US7342296B2 Wafer street buffer layer Electricity 6 Expired

Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.