Method and system for analyzing circuit pattern defects
US7062081B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 15, 2001 |
| Grant date | Jun 13, 2006 |
| Priority date | — |
| Expiry date | Sep 2, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30148
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
In order to allow critical flaws in an inspected item to be determined early during a production process, the present invention includes the following steps: a step of detecting defects in a production process for the inspected item and storing defect positions; a step of collecting detailed defect information and storing the detailed information in association with defect positions; a step of storing positions at which flaws were generated based on a final inspection of the inspected item; a step of comparing defect positions with positions at which flaws were generated; and a step of classifying and displaying detailed information based on the comparison results.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.