Submount for a photonic integrated circuit (PIC) chip
US7062114B2 · kind B2 · utility
33Cited by
79References
37Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 25, 2004 |
| Grant date | Jun 13, 2006 |
| Priority date | — |
| Expiry date | Jun 29, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F55/18
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A photonic integrated circuit (PIC) chip with a plurality of electro-optic components formed on a major surface of the chip and a submount that includes a substrate that extends over the major surface of the chip forming an air gap between the substrate and the major surface, the substrate to support electrical leads for electrical connection to some of the electro-optic components on the chip major surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.