Test masks for lithographic and etch processes
US7062730B2 · kind B2 · utility
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Key dates
| Filing date | Dec 17, 2002 |
| Grant date | Jun 13, 2006 |
| Priority date | — |
| Expiry date | Apr 7, 2023 |
Classification
- Technology area (CPC —)General
Abstract
A mask design is generated for patterning a test wafer using a lithographic or etch process, the process is characterized based on the patterned test wafer, and a pattern-dependent model is used based on the characterization to predict characteristics of integrated circuits that are to be fabricated by the lithographic or etch process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.