Patent · US Revoked

Test masks for lithographic and etch processes

US7062730B2 · kind B2 · utility

0Cited by
50References
17Claims
0Family size

Assignee

Inventors

Key dates

Filing dateDec 17, 2002
Grant dateJun 13, 2006
Priority date
Expiry dateApr 7, 2023

Classification

  • Technology area (CPC —)General

Abstract

A mask design is generated for patterning a test wafer using a lithographic or etch process, the process is characterized based on the patterned test wafer, and a pattern-dependent model is used based on the characterization to predict characteristics of integrated circuits that are to be fabricated by the lithographic or etch process.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.