Negative photoresist compositions for the formation of thick films, photoresist films and methods of forming bumps using the same
US7063934B2 · kind B2 · utility
7Cited by
10References
8Claims
0Family size
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Key dates
| Filing date | May 20, 2002 |
| Grant date | Jun 20, 2006 |
| Priority date | — |
| Expiry date | May 20, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/113
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A negative photoresist composition is used for the formation of thick films and includes (A) a novolak resin, (B) a plasticizer, (C) a crosslinking agent and (D) an acid generator. The composition is applied onto a substrate and thereby yields a photoresist film 5 to 100 μm thick. Likewise, the composition is applied onto a substrate of an electronic part, is patterned, is plated and thereby yields a bump.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.