Coating material for electronic components

US7064176B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Marcus Halik · Erlangen, DE
• Klaus Lowack · Erlangen, DE
• Recai Sezi · Simmerath, DE
• Andreas Walter · Egloffstein, DE

Key dates

• Filing date: Mar 28, 2002
• Grant date: Jun 20, 2006
• Expiry date: Apr 29, 2022

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C08G73/22
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

The invention relates to novel polyhydroxyamide compounds that, in the form of their oxazoles, ane suited as a coating material, particularly for electronic components. The invention also relates to a method for producing these novel compounds and to the use thereof.