Method for aligning the bondhead of a Die Bonder
US7066373B2 · kind B2 · utility
5Cited by
12References
2Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 10, 2004 |
| Grant date | Jun 27, 2006 |
| Priority date | — |
| Expiry date | Oct 10, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K13/0815
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In order to eliminate the inclination of a semiconductor chip picked by a gripper, the height of at least three points on the underneath of the semiconductor chip is determined in relation to a reference surface and from this the inclination is calculated. Determining the heights takes place in that the semiconductor chip is lowered until the semiconductor chip comes into contact with a needle.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.