Stefan Behler
6Patents
3h-index
7Co-inventors
46Inventor score
Filing activity: Dec 8, 2000 → Oct 15, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8133823B2 | Method for picking up semiconductor chips from a wafer table and method for mounting semiconductor chips on a substrate | Physics | 6 | Active |
| US6435492B1 | Die bonder and/or wire bonder with a suction device for pulling flat and holding down a curved substrate | Electricity | 6 | Expired |
| US7066373B2 | Method for aligning the bondhead of a Die Bonder | Electricity | 5 | Expired |
| US8715457B2 | Method for detaching and removing a semiconductor chip from a foil | Emerging Cross-Sectional Technologies | 2 | Active |
| US6585145B2 | Die bonder and/or wire bonder with a device for holding down a substrate | Electricity | 0 | Expired |
| US12062566B2 | Die ejector | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.