Area array package with low inductance connecting device
US7066740B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 30, 2003 |
| Grant date | Jun 27, 2006 |
| Priority date | — |
| Expiry date | Aug 10, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An area-array integrated circuit package assembly are provided with a plurality of electrically conductive connectors attached to the package I.O. pads, that are used to connect the package to a printed circuit card or other component. The connectors comprise at least two parallel conductors flexing together in the same direction, electrically insulated from each other for a portion of their length between the package and printed circuit card to provide for reduced interconnection inductance. The connection with the component contact pads can be achieved by mechanically pressing the package and circuit card together or with the use of bonding material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.