Automated system for handling and processing wafers within a carrier
US7067018B2 · kind B2 · utility
2Cited by
15References
3Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 19, 2002 |
| Grant date | Jun 27, 2006 |
| Priority date | — |
| Expiry date | May 8, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/138
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A workpiece handling and processing system has a interface section for loading wafers from cassettes into carriers. The wafers are lifted out of cassettes by a buffer elevator and moved into a position over an open carrier by a buffer robot. A comb elevator lifts combs entirely through the open cassette, to transfer the wafers from the buffer robot into the carrier. A process robot moves loaded carriers from the interface section to one or more process chambers in a process section. The advantages of processing wafers within a carrier are achieved within a compact space and with high throughput.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.