Method to improve the control of electro-polishing by use of a plating electrode an electrolyte bath
US7067048B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 8, 2003 |
| Grant date | Jun 27, 2006 |
| Priority date | — |
| Expiry date | Feb 20, 2024 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25F7/02
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method and apparatus which uses a plating electrode in an electrolyte bath. The plating electrode works to purify an electrolyte polishing solution during the electro-polishing process. Preferably, the plating electrode is employed in a closed loop feedback system. The plating electrode may be powered by a power supply which is controlled by a controller. A sensor may be connected to the controller and the sensor may be configured to sense a characteristic (for example, but not limited to: resistance, conductance or optical transmission, absorption of light, etc.) of the electrolyte bath, which tends to indicate the level of saturation. Preferably, the plating electrode is easily replaceable.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.