Inductor formed in an integrated circuit
US7068139B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 29, 2004 |
| Grant date | Jun 27, 2006 |
| Priority date | — |
| Expiry date | Sep 29, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4902
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An inductor formed within an integrated circuit and a method for forming the inductor. The inductor comprises an underlying layer of aluminum formed in a first metallization layer and patterned and etched into the desired shape. In one embodiment the aluminum line comprises a spiral shape. According to a damascene process, a conductive runner, preferably of copper, is formed in a dielectric layer overlying the aluminum line and in electrical contact therewith. The aluminum line and the conductive runner cooperate to form the inductor. In another embodiment the aluminum line and the conductive runner are formed in a vertically spaced-apart orientation, with tungsten plugs or conductive vias formed to provide electrical connection therebetween. A method for forming the inductor comprises forming an aluminum conductive line and forming a conductive runner over the conductive line.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.