Dissipating heat reliably in computer systems
US7068510B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 4, 2003 |
| Grant date | Jun 27, 2006 |
| Priority date | — |
| Expiry date | Sep 19, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73253
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A blade server module comprising: a housing assembly; a printed circuit board disposed within the housing assembly and mounted in a free-floating relationship thereto; a processor mounted on the printed circuit board; heat sink assembly disposed in the housing assembly in close proximity to the processor; and, one or more compliant compression elements disposed within the housing assembly so as to be preloaded to provide a force on the printed circuit board to force the heat source into thermal engagement with the heat sink assembly. Methods and systems are disclosed for effectively dissipating heat reliably in compact packaging arrangements that are particularly adapted for computing systems including blade servers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.