Arvind K. Sinha
110Patents
15h-index
59Co-inventors
85Inventor score
Filing activity: Dec 13, 1999 → Feb 27, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6970360B2 | Tamper-proof enclosure for a circuit card | Emerging Cross-Sectional Technologies | 96 | Expired |
| US7214874B2 | Venting device for tamper resistant electronic modules | Emerging Cross-Sectional Technologies | 72 | Expired |
| US8287336B2 | Method of manufacturing a venting device for tamper resistant electronic modules | Emerging Cross-Sectional Technologies | 72 | Active |
| US8961280B2 | Method of manufacturing a venting device for tamper resistant electronic modules | Emerging Cross-Sectional Technologies | 65 | Active |
| US6385044B1 | Heat pipe heat sink assembly for cooling semiconductor chips | Electricity | 37 | Expired |
| US7298623B1 | Organic substrate with integral thermal dissipation channels, and method for producing same | Emerging Cross-Sectional Technologies | 33 | Active |
| US9414526B2 | Cooling apparatus with dynamic load adjustment | Electricity | 28 | Active |
| US8911244B2 | Receptacle with heat management for electronic and optical systems | Electricity | 25 | Active |
| US6475011B1 | Land grid array socket actuation hardware for MCM applications | Electricity | 24 | Expired |
| US6449155B1 | Land grid array subassembly for multichip modules | Electricity | 22 | Expired |
| US7499279B2 | Cold plate stability | Electricity | 21 | Active |
| US7751918B2 | Methods for configuring tubing for interconnecting in-series multiple liquid-cooled cold plates | Physics | 20 | Active |
| US8952258B2 | Implementing graphene interconnect for high conductivity applications | Emerging Cross-Sectional Technologies | 19 | Active |
| US7486516B2 | Mounting a heat sink in thermal contact with an electronic component | Emerging Cross-Sectional Technologies | 18 | Active |
| US7777329B2 | Heatsink apparatus for applying a specified compressive force to an integrated circuit device | Electricity | 16 | Active |
| US8544337B2 | Piezoelectric chromic impact sensor | Physics | 14 | Active |
| US7382620B2 | Method and apparatus for optimizing heat transfer with electronic components | Electricity | 11 | Expired |
| US7606033B2 | Mounting a heat sink in thermal contact with an electronic component | Emerging Cross-Sectional Technologies | 11 | Active |
| US9245813B2 | Horizontally aligned graphite nanofibers in etched silicon wafer troughs for enhanced thermal performance | Electricity | 10 | Active |
| US8716597B2 | Implementing enhanced dimensional stability with graphite nanotube hybrid socket | Performing Operations; Transporting | 10 | Active |
| US7068510B2 | Dissipating heat reliably in computer systems | Electricity | 9 | Expired |
| US6634095B2 | Apparatus for mounting a land grid array module | Emerging Cross-Sectional Technologies | 9 | Expired |
| US9609744B2 | Area array device connection structures with complimentary warp characteristics | Emerging Cross-Sectional Technologies | 8 | Active |
| US7352575B2 | Dynamic air moving system | Electricity | 8 | Active |
| US6757965B2 | Method of installing a land grid array multi-chip modules | Emerging Cross-Sectional Technologies | 8 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.